Tag Archives: internship

Undergraduate Internship Opportunity at Smart Material Solutions

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Smart Material Solutions, Inc. (SMS) is seeking two REU students for 10 week paid summer internships. SMS is a small NC State startup in Raleigh, NC that is developing an advanced nanomanufacturing process called nanocoining. The patented process can seamlessly nanopattern drum molds for roll-to-roll manufacturing hundreds of times faster than competing technologies like electron-beam lithography.

Internship 1: Nanocharacterization This intern will use SMS’s molds to create nanostructured polymer films and perform nanocharacterization to compare the 3D shapes of the nanofeatures in the diamond die, indented mold, and replicated polymer film. This student will receive training on several characterization techniques such as SEM, AFM, and confocal microscopy. SMS prefers a student with a background in materials science, chemical engineering, nanotechnology, or a related field.

Internship 2: Thermal Control System The second REU student will create a temperature control system for SMS’s custom ultrasonic resonant actuator. SMS is interested in hiring a student with a strong background in mechanical engineering, thermal systems, and data acquisition.

For more information, please review this flier. To apply, send your resume to miller@smartmaterialsolutions.com and specify which internship interests you.

Graduate Student Internship Opportunity at Micross – Apply now

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Micross AIT is looking to immediately hire an MS or PhD candidate student with thin film deposition and/or wafer processing experience for a 6 month internship, ideally 20-25 hrs/week. The work schedule is flexible so the student can honor his/her commitments for obtaining his/her degree. The current position is funded from January – June 2019, with an option to extend through the end of the summer. (Please note, student must be a US citizen or permanent resident to apply for this position.)

Summary:

The internship will initially focus on supporting through-Si Via (TSV) integration process enhancements, including, but not limited to TSV liners, barrier layers, metallization, and plating. Future focus for this position may include thin film deposition and wafer processing for novel MEMS-like device structures. This position will support internally and externally funded development projects.

Essential Duties & Responsibilities:

  • Hands-on engineering resource for integration process enhancements.
  • Participate and conduct process improvement experiments, accurately recording and reporting data
  • Employ standard troubleshooting protocols

For more information and to apply, please see the job posting.